Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1675088 | Thin Solid Films | 2006 | 7 Pages |
Abstract
In the present work, cast thermoplastic starch films were successfully modified by plasma of 1,3-butadiene to reduce water sensitivity. To overcome the difficulties involved in plasma coating of substrates with high water content, high base pressure was used before the introduction of the working gas and mild deposition parameters were employed. The coatings produced at 6Â Pa base pressure were smooth, oxygen free and presented low internal stress. After being coated under these mild conditions, cornstarch films were submitted to wettability measurements and atomic force microscopy (AFM) morphological evaluation. Results showed that the coating process improved significantly the cornstarch films' physical properties; water absorption was reduced up to 80%, while water contact angle increased more than 100%. AFM images indicated that the produced coatings cover homogeneously all the different regions of the cornstarch film.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
R.A. Simão, R.M.S.M. Thiré, P.R. Coutinho, P.J.G. de Araújo, C.A. Achete, C.T. Andrade,