| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1675395 | Thin Solid Films | 2006 | 4 Pages |
Abstract
Moisture ingression in plastic packages essentially occurs through delaminated interfaces. Hence, package reliability depends on the interfacial integrity between the various materials. In the present work, the adhesion of epoxy-based molding compound and the copper leadframe is discussed. Results show that by the growth of a copper oxide layer, the surface roughness improves which promotes interlocking between the molding compound and leadframe during mold packing stage. Also by controlling the oxide thickness with pore-free structure, the adhesion strength can be significantly improved.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Narasimalu Srikanth, Lewis Chan, Charles J. Vath III,