Chemically vapour deposited diamond coatings on cemented tungsten carbides: Substrate pretreatments, adhesion and cutting performance

Chemical vapour deposition (CVD) of diamond films onto Co-cemented tungsten carbide (WC-Co) tools and wear parts presents several problems due to interfacial graphitization induced by the binder phase and thermal expansion mismatch of diamond and WC-Co. Methods used to improve diamond film adhesion include substrate-modification processes that create a three-dimensional compositionally graded interface. This paper reviews substrate pretreatments and adhesion issues of chemically vapour deposited diamond films on WC-Co. The combined effect of pretreatments and substrate microstructure on the adhesive toughness and wear rate of CVD diamond in dry machining of highly abrasive materials was analyzed. The role of diamond film surface morphology on chip evacuation in dry milling of ceramics was also investigated by comparing feed forces of coated and uncoated mills. The overall tribological performance of diamond coated mills depended on coating microstructure and smoothness. The use of smother films did allow to reduce cutting forces by facilitating chip evacuation.