Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1676915 | Thin Solid Films | 2006 | 5 Pages |
Abstract
As device scaling for high-performance bipolar transistors continues, not only the vertical scaling but also the lateral scaling with reduction of the parasitics can have an important impact on the reliability of the HBT. In this work we will present the impact on the RF performance and the reliability of the vertical and lateral scaling of a SiGe:C HBT with a low-complexity QSA (quasi self-aligned) architecture. The reliability will be assessed for three different stress modes.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
A. Piontek, L.J. Choi, S. Van Huylenbroeck, T. Vanhoucke, E. Hijzen, S. Decoutere,