| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1676995 | Thin Solid Films | 2006 | 4 Pages |
Abstract
Localized etching of silicon wafers has been studied using a scanning atmospheric-pressure microplasma jet. Effects of the nozzle height, Ar and SF6 gas flow rates and the scan speed of the microplasma jet have been investigated to clarify the fundamental characteristics of scanning microplasma processing. Maskless pattern etching according to the CAD data has been successfully carried out using a prototype of the scanning microplasma jet (SMPJ) etcher. Line art etching, flat thinning of the local area, and pseudo-three dimensional etching has been demonstrated to show its promising potential as a rapid microfabrication tool.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Takuya Ideno, Takanori Ichiki,