Article ID Journal Published Year Pages File Type
1677212 Thin Solid Films 2006 5 Pages PDF
Abstract

Using a recently developed sputter deposition technique, ZnO deposits were grown at the room temperature on silicon wafers with various kinds of copper surface layers. The copper layers were prepared using sputter deposition, thermal evaporation, or electroless plating technique. It was found that the surface copper prepared using both sputter deposition and thermal evaporation technique grew only ZnO thin films, while the surface copper prepared using sputter deposition technique grew ZnO nanorods/thin-film deposits. The relation between the copper characteristics and the growth of ZnO nanorods/thin-film deposits was investigated. The growth kinetics of the ZnO nanorods/thin film structure is also discussed.

Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
Authors
, ,