Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1687039 | Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms | 2009 | 4 Pages |
Abstract
In this study, the molecular dynamics simulation method was employed to investigate the growth of silicon nitride films by using N+ ions, with energies of 50, 100, 150 and 200 eV, to bombard an amorphous silicon surface at 300 K. After an initial period of N+ bombardment, saturation of the number of N atoms deposited on the surface is observed, which is in agreement with experiments. During subsequent steady state deposition, a balance between uptake of N by the surface and sputtering of previously deposited N is established. The Si(Nx) (x = 1–4) and N(Siy) (y = 1–3) bond configurations in the grown films are analyzed.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
F. Gou, M.A. Gleeson, A.W. Kleyn, R.W.E. van de Kruijs, A.E. Yakshin, F. Bijkerk,