Effect of reactive sputtered SiOx passivation layer on the stability of InGaZnO thin film transistors

We fabricated the indium-gallium-zinc oxide (IGZO) thin film transistor (TFT) with reactive sputtered SiOx as passivation layer, and investigated the role of the SiOx passivation layer in the IGZO-TFT under gate bias stress. The bias stability of IGZO-TFT with passivation layer is much better than that of IGZO-TFT without passivation layer. After applying positive bias stress of 20 V for 10000s, the device without passivation layer shows a larger positive Vth shift of 7.3 V. However, the device with passivation layer exhibits a much smaller Vth shift of 1.3 V. It suggests that Vth instability is attributed to the interaction between the exposed IGZO back surface and oxygen in ambient atmosphere during the positive gate voltage stress. The results indicate that reactive sputtered SiOx passivation layer can effectively improve the bias stability of IGZO-TFT.

► Reactive sputtered SiOx film for passivation. ► Improving bias stress stability of IGZO-TFT. ► Impact of passivation layer on device stability. ► Calculation of energy activation.