Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1689753 | Vacuum | 2015 | 5 Pages |
Abstract
The present study investigates the microstructure and grain boundaries evolutions during recrystallization of commercial FeCo-â¼7 wt.% V. The resulting microstructures were characterized using electron back scatter diffraction after annealing at different temperatures. At low temperatures (â¼400 °C), where only recovery occurs during annealing, the fraction of low angle boundaries was increased. But, at high temperatures (â¼850 °C), where recrystallization occurs during annealing, the fraction of high angle boundaries and low-Σ coincidence site lattice (CSL) boundaries (especially Σ3) were increased.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
S. Hasani, M. Shamanian, A. Shafyei, P. Behjati, H. Mostaan, P. Sahu, J.A. Szpunar,