Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1690687 | Vacuum | 2006 | 10 Pages |
Abstract
Deposition of plasma polymer films by r.f. magnetron sputtering of polyimide in an atmosphere of argon, nitrogen and in a self-sputtering mode is studied. In situ analytical techniques are applied to monitor the composition of both plasma and growing film during the deposition. A co-evaporation regime is observed at higher applied powers. Such a regime is characterized by a significant increase in deposition rate of plasma polymer films. In addition CO-based groups appear in the plasma volume and in the resulting films. The films deposited in a pulsed mode are similar in composition to those deposited in the continuous regime at equivalent power. The plasma polymer films are found to be stable to short-term oxidation in air.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
A. Choukourov, J. Hanuš, J. Kousal, A. Grinevich, Y. Pihosh, D. Slavínská, H. Biederman,