Article ID Journal Published Year Pages File Type
1691538 Vacuum 2009 4 Pages PDF
Abstract

Standard 20 Ωcm boron doped Cz Si wafers were subjected to 100 keV hydrogen ion implantation at room temperature to fluences of 1 × 1016 or 4 × 1016 at/cm2. Subsequently, nitrogen was incorporated in silicon from a DC plasma source at a temperature of 300 °C. Finally, all samples were annealed at 700 °C for 2 h in vacuum. Structural properties of samples were studied by SIMS and SEM. The SEM study was carried out both in the secondary electrons (SE) and the Surface-Electron-Beam-Induced-Voltage (SEBIV) modes. The experiments have demonstrated that incorporated from plasma nitrogen atoms were accumulated in the buried damage layer and the formed nitrogen-containing layer has an island-like structure.

Related Topics
Physical Sciences and Engineering Materials Science Surfaces, Coatings and Films
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