Bottom-coverage simulation for magnetron-sputtering apparatus activated with superconducting bulk magnet

The bottom coverage in circular via holes for magnetron sputtering apparatus equipped with a superconducting bulk magnet was analyzed using computer simulation. Owing to the high magnetic field, the apparatus allowed film deposition under low pressure. In the simulation, the transport of sputtered atoms was treated by the Monte Carlo method and the film deposition was calculated using a string model. The simulated results qualitatively reproduced the behavior of the measured bottom coverage. However, considerable deviation was observed depending on the geometry. It was ascribed to factors such as resputtering, reflection, and surface diffusion.