Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1691845 | Vacuum | 2007 | 6 Pages |
Abstract
The relative densities of SiCln (n=0-2) in SiCl4 radio frequency (rf) glow discharge plasma are measured by mass spectrometry. The effects of discharge parameters, including rf power, discharge pressure, substrate temperature and SiCl4 flow rate on the relative densities of SiCln (n=0-2) are investigated in detail. The experimental results demonstrate that the relative densities of SiCln (n=0-2) in SiCl4 plasma are dependent strongly on these discharge parameters. An optimum configuration of discharge parameters (low rf power, high discharge pressure, low substrate temperature and low flow rate), which enhanced the formation of SiCln (n=0-2) radicals, was searched. Further, researching of SiCln (n=0-2) spatial distribution for seeking a suitable deposition condition is beneficial for understanding the deposition mechanism of thin films.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
Z.K. Wang, Y.H. Lou, K.X. Lin, X.Y. Lin,