An experimental investigation into micro ball end-milling of silicon

Silicon is a representative operational material for semiconductor and micro-electronics. In certain MEMS applications, it is required to fabricate three dimensional channels and complex pattern on silicon substrate. Such features are typically fabricated by photolithography and chemical etching. These processes have low productivity and have certain other limitations. Therefore, a viable switch-over from non-traditional fabrication processes to traditional machining is highly desired for improved productivity in high-mix low-volume production. However, machining of silicon by traditional process is extremely difficult due to its high brittleness. Even very small forces produced during machining can cause brittle fracture on silicon surface resulting in deteriorated surface quality. The fundamental principle in machining of a brittle material such as silicon is to achieve material removal through plastic deformation rather than crack propagation. This paper presents the experimental results of ductile-mode machining of silicon by micro ball end-milling. The workpiece surface was inclined to the rotational axes of the cutter to improve the surface finish. It was established experimentally that 15-μm deep, fracture-free slots can be machined on silicon wafer by micro ball end-milling if the feed rate is below a certain threshold. The influence of several machining parameters on the roughness of machined-surface was also investigated. Cubic boron nitride (CBN) is presented as much economical alternative tool-material to single-crystal diamond for machining silicon in ductile-mode.