Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1701073 | Procedia CIRP | 2013 | 5 Pages |
Abstract
The dynamic process behavior during milling often leads to vibrations or even chatter and, thereby, to surface location errors. In this paper, a multi-scale simulation system is presented, which can predict these errors efficiently by combining a dexel-based workpiece representation with a CSG-based process model and an oscillator-based system for the process dynamics. The different modeling techniques are described, and the run-time of the combined system is compared to a single-scale system in which the CSG-based model is used for every process step. Furthermore, the simulation is validated by examining the generated surface of a micromachined workpiece.
Related Topics
Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering