Article ID Journal Published Year Pages File Type
178601 Education for Chemical Engineers 2006 15 Pages PDF
Abstract

A software package for the simulation of thermal radiation in an enclosure is presented. The simulator has been developed using an object-oriented approach based on Java. The enclosure is a parallelepiped and contains an obstructing surface (wafer) and point sources (filament). Thermal radiation problems in the enclosure can be set up quickly and solved easily through a graphical user interface (GUI). Advanced GUI features, such as radio buttons and tabbed panes, have been used in the simulator along with extensive graphical output, including an interactive three-dimensional view of the enclosure. The simulator is portable on three different platforms: Macintosh, Windows and LINUX. It is very robust and can solve thermal radiation exchange in black, grey and non-grey enclosures.

Related Topics
Physical Sciences and Engineering Chemical Engineering Chemical Engineering (General)