Simulation of temperature and gas density field distribution in diamond films growth on silicon wafer by hot filament CVD

In the present study, the temperature and gas density field inside the hot filament chemical vapor deposition (HFCVD) reactor, which play a determinate role on the growth rate and quality of as-deposited diamond films, are simulated using the finite volume method, and the influence of the size and arrangement of filaments and inlets are investigated. Firstly, the correctness of the simulation model is verified by comparing the temperature data obtained from the simulation with that measured in an actual depositing process, and the results show that the error between them is less than 3%. Thereafter, the deposition parameters are optimized using this model as N(filament number)=6, r(filament radius)=0.4 mm, D(filament separation)=16–18 mm, H(substrate–filament distance)=8–9 mm, and 25 inlets. Finally, diamond films are deposited on silicon (100) wafers using above parameters and the results of characterization by SEM and Raman spectrum exhibit that the deposited diamond films appear homogeneous surface with fine-faceted crystals.

► The temperature and gas density field distribution inside HFCVD are simulated. ► The finite volume method is adopted in this simulation. ► The simulated temperatures are found to be in reasonable agreement with actual ones. ► The arrangement of filaments and gas inlets are optimized using simulated method.