Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1792648 | Journal of Crystal Growth | 2011 | 4 Pages |
Abstract
We have developed a dual-step encapsulation process for phosphorus in germanium δ-layers with initial low-temperature encapsulation to suppress dopant redistribution, followed by a higher temperature overgrowth to improve crystalline quality and electrical transport properties. Structural and electrical characterization shows that encapsulation of the δ-layer with a 2-nm-thick Ge layer deposited at 350 °C followed by Ge growth at 530 °C confines P donors into an atomically flat layer with limited dopant segregation, high carrier concentration and low resistivity. This doping method is promising for the fabrication of ultra-shallow junctions.
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Condensed Matter Physics
Authors
G. Scappucci, G. Capellini, W.M. Klesse, M.Y. Simmons,