Directed self-assembly of mesoscopic electronic components into sparse arrays with controlled orientation using diamagnetic levitation

•Self-assembly of semiconductor dies into arrays using diamagnetic levitation.•Control over the die orientation in vertical and lateral dimensions.•Simulation shows good scalability of assembly time with the number of dies.•Suitable for assembly of LED panels, displays and microcell photovoltaics.

This paper presents a directed self-assembly (DSA) approach for assembling small electronic components, such as semiconductor dies, into sparse 2D arrays using diamagnetic levitation. The dies attached to a diamagnetic layer can be levitated at a room temperature over a stage made of magnets arranged in a checkerboard pattern. By selecting a proper die design, levitation height, and vibration pattern of the magnetic stage we assemble the dies into a regular 2D array with a specific lateral and vertical orientation of the dies. The assembled dies are transferred to a receiving substrate using capillary force.