| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1804030 | Journal of Magnetism and Magnetic Materials | 2008 | 6 Pages |
Abstract
The microstructure of a CoNiFeB film for a soft magnetic underlayer of perpendicular recording media, which was deposited by electroless plating on a Si wafer, has been investigated by transmission electron microscopy and a three-dimensional atom probe. After the deposition of the CoNiFeB film on a Ni underlayer, Hc decreased from about 62 to about 3 Oe. Based on the microstructure observation results, the decrease of Hc was concluded to be the result of reduced magneto-elastic energy. The good adhesiveness between the soft underlayer (SUL) and the Si substrate was found to be due to the composition gradient.
Keywords
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Physical Sciences and Engineering
Physics and Astronomy
Condensed Matter Physics
Authors
Y.K. Takahashi, K. Hono, M. Ishii, S. Itoh, K. Ohashi,