Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1814981 | Physica B: Condensed Matter | 2007 | 4 Pages |
Abstract
The diffusion rate of Co in Ge is found to be as fast as 2Ã10-6cm2s-1 at 900 °C, whereas the Co solubility comes close to 1Ã1016cm-3 at the same temperature. Based on these properties and its acceptor activity, Co may cause serious contamination problems during the fabrication of Ge-based electronic devices. In contrast to an early radiotracer study [L.Y. Wei, J. Phys. Chem. Solids 18 (1961) 162], we observe common diffusion profiles of complementary error function type, which are indicative of a constant diffusivity depending only on temperature. A preliminary analysis of the data points to the dissociative diffusion mechanism involving interstitial-substitutional exchange via vacancies. However, in contrast to Cu, which migrates via the vacancy-controlled mode of the dissociative mechanism, the diffusion of Co may be rate-limited by the transport properties of its interstitial modification (Coi).
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Condensed Matter Physics
Authors
L. Lerner, N.A. Stolwijk,