Development of CdTe hybrid detector with CMOS charge integration amplifier

A pixelated CdTe detector module is being developed for use in X-ray imaging application. The CdTe is expected to allow higher energy detection capability because of the high atomic number. And also, high resolution imaging becomes possible with a direct conversion method in which an incident X-ray photon is directly converted to electric charges. This paper reports the first results of a 50 μm pitch, 64×64 pixels, CdTe hybrid imaging module with CMOS charge integration readout ASIC with a flip chip bonding technique.