Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1825321 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2011 | 8 Pages |
Abstract
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
P. Grenier, G. Alimonti, M. Barbero, R. Bates, E. Bolle, M. Borri, M. Boscardin, C. Buttar, M. Capua, M. Cavalli-Sforza, M. Cobal, A. Cristofoli, G.-F. Dalla Betta, G. Darbo, C. Da Vià, E. Devetak, B. DeWilde, B. Di Girolamo, D. Dobos, K. Einsweiler,