| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1831365 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2007 | 5 Pages |
Abstract
The experience with mass production bump bonding with outside vendors gained in the CMS Forward Pixel project is discussed. Results from two different vendors are presented. After an initial R&D and pre-production phase, 20% of the production parts have been completed. The main results are shown here.
Keywords
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
Petra Merkel,