| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1831791 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2006 | 7 Pages |
Abstract
The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The production is half-way through at the time of this writing. This paper also discusses the problems encountered during production and the adopted solutions.
Keywords
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
G. Alimonti, A. Andreazza, A. Bulgheroni, G. Corda, S. Di Gioia, A. Fiorello, C. Gemme, M. Koziel, F. Manca, C. Meroni, P. Nechaeva, A. Paoloni, L. Rossi, A. Rovani, E. Ruscino,