| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1832957 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2006 | 4 Pages |
Abstract
Synchrotron-radiation imaging was applied to the non-destructive testing of detector devices during their development cycle. Transmission imaging known as computed laminography was used to examine the microstructure of the interconnections in order to investigate the perfection of technological steps necessary for hybrid detector production. A characterisation of the solder bump microstructure can reveal production flaws such as missing or misaligned bumps, voids in bumps or bridges and thus give valuable information about the bonding process.
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
L. Helfen, A. Myagotin, P. Pernot, M. DiMichiel, P. Mikulík, A. Berthold, T. Baumbach,