The Effects of Joining Methods on the Resistivity of W-Cu Alloy and Cu Joint

In this paper, three joining methods are employed to join W-Cu alloy and Cu to investigate the effect of joining methods on the resistivity of the joint. The results show that W-Cu alloy is well bonding to the Cu substrate when joining by diffusion vacuum bonding and brazing in vacuum methods. Welding defects is apt to occur when joining by brazing in air. The lowest resistivity of the joint welded is obtained by vacuum diffusion bonding, which approximates to the W-Cu alloy while that for the joint brazed in air is the highest. Vacuum diffusion bonding method is the best choice when the demand of conductivity is vital while the mechanical reliability is not critical. Otherwise, brazing in vacuum is the prior option.