| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1873601 | Physics Procedia | 2011 | 5 Pages |
Abstract
Aluminum film deposited on GFRP, in this paper by cathodic arc technology for decreasing the reflect wastage. The aluminum film have been characterized by pull test, Dektak 8 Stylus Profilometer, SEM, XPS, XRD and Z-82 standard four probe. The results show that the aluminum film, be compose of face centered cubic (fcc) structure, is compact, uniform. And the resistivity of film is close to bulk aluminum. The XPS spectra show that the Al-C, Al-O bonds were created in film deposition process.
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