Article ID Journal Published Year Pages File Type
188316 Electrochimica Acta 2012 7 Pages PDF
Abstract

Polyaniline (PANI)/titanium dioxide (TiO2) composites were prepared with a chemical oxidation polymerization of aniline monomer (ANI) with various molar ratios between ANI and para toluenesulfonic acid (p-TSA). To find an effect of the [ANI]:[p-TSA] molar ratio on the electrochemical properties of the prepared PANI/TiO2 composites, the composites were synthesized under same conditions except the p-TSA concentrations. The prepared composite films had more homogeneous TiO2 dispersion with changing [ANI]:[p-TSA] molar ratios from 6:1 to 1:1. p-TSA surfactant-like doping acid helped the dispersion of TiO2 particles in the PANI matrix. PANI covering the TiO2 surfaces was confirmed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Prepared PANI films on the TiO2 particles had the smoothest surface when the ANI and p-TSA had 1:1 molar ratio in the reaction solution. The composite prepared with molar ratio [ANI]:[p-TSA] of 3:1 had the highest capacitance (800 F g−1) among the prepared composites.

Graphical abstractPolyaniline (PANI)/TiO2 composites were prepared by in situ polymerization using para-toluenesulfonic acid (p-TSA). The composites showed different morphology and specific capacitances as a function of aniline concentration, which are related to the morphology (shape or size) of particles. Scheme of the formation of composites consisting of PANI film and the micelle structures is shown.Figure optionsDownload full-size imageDownload as PowerPoint slideHighlights► PANI/TiO2 composite were prepared with a different concentration of monomer and dopant. ► Aniline/acid ratio influenced the morphological and electrochemical properties. ► The composites showed different capacitances as a function of aniline concentrations. ► Aniline/acid ratio could influence on the dispersion and surface roughness of particles.

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Physical Sciences and Engineering Chemical Engineering Chemical Engineering (General)
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