| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 188340 | Electrochimica Acta | 2012 | 6 Pages |
The cathodic reduction of nitrate at copper electrodes was investigated by using scanning electrochemical microscopy (SECM) in the stripping-mode SECM (SM-SECM). This electrochemical process is facilitated at surfaces activated by a potential protocol involving anodic dissolution and subsequent reduction of copper cations, which causes an increase in the surface area. In the presence of chloride, a much more significant current enhancement was noticed, and a mechanism based on the formation of CuCl was proposed to explain the increased rate of nitrate reduction at this experimental condition.
Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights► Scanning electrochemical microscopy was used to monitor Cu(I) species formed at a copper substrate. ► The formation of CuCl provides a rougher copper surface. ► The kinetic for nitrate reduction is enhanced at the rougher copper surface.
