| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 190822 | Electrochimica Acta | 2011 | 9 Pages |
The influence of crystallographic orientation on the anodic dissolution of copper in sodium nitrate under near ECM conditions was investigated in situ by a specially designed electrochemical flow channel cell. The investigation was limited to the active dissolution range where a distinctive influence of the microstructure on the anodic dissolution was expected. It was clearly shown that the topography strongly depends on the crystallographic orientation. The dissolution rate of less-packed {1 0 0} planes is higher than of the close-packed {1 1 1} planes. Additionally, a gas evolution as side reaction was temporarily observed. This process happens preferentially on {1 1 1} planes.
► The anodic dissolution of copper under near ECM conditions was investigated in situ. ► The dissolution process is strongly influenced by the crystallographic orientation of copper. ► Oxygen evolution was observed as temporary process which decreases over the time of experiment and is only observed in every first pulse. ► Oxygen evolution seems to be preferentially on grains vicinal to {1 1 1}.
