Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
192108 | Electrochimica Acta | 2010 | 4 Pages |
Abstract
An electroplated copper/tin (Cu/Sn) anode with a layered structure is described that minimizes the high-voltage irreversible capacity observed in an electroplated Sn anode at a potential over 1 V. The high-voltage irreversible capacity is caused by the electrolyte decomposition at the catalytic site of the Sn anode. In the electroplated Cu/Sn anode, the upper Cu layer effectively suppresses the exposure of the newly formed Sn surfaces, resulting in the absence of the high-voltage irreversible capacity. Therefore, the electroplated Cu/Sn anode exhibits a higher cycle performance than the electroplated Sn anode.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
JungWon Park, JiYong Eom, HyukSang Kwon,