Article ID Journal Published Year Pages File Type
192108 Electrochimica Acta 2010 4 Pages PDF
Abstract

An electroplated copper/tin (Cu/Sn) anode with a layered structure is described that minimizes the high-voltage irreversible capacity observed in an electroplated Sn anode at a potential over 1 V. The high-voltage irreversible capacity is caused by the electrolyte decomposition at the catalytic site of the Sn anode. In the electroplated Cu/Sn anode, the upper Cu layer effectively suppresses the exposure of the newly formed Sn surfaces, resulting in the absence of the high-voltage irreversible capacity. Therefore, the electroplated Cu/Sn anode exhibits a higher cycle performance than the electroplated Sn anode.

Related Topics
Physical Sciences and Engineering Chemical Engineering Chemical Engineering (General)
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