Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
192522 | Electrochimica Acta | 2008 | 7 Pages |
Abstract
The enrichment of copper alloying additions near the surface of sputtering-deposited Al–1.3 at.%Cu, Al–2.7 at.%Cu and Al–30 at.%Cu alloys is investigated following immersion in nitric acid, which is used commercially as a de-smutting pre-treatment. Corrosion of the alloys is revealed at rates in the range 4–13 nm min−1, leading to enrichment of copper in the alloy surface regions. Enrichments are also generated by nitric acid treatment of AA2024-T3 and AA7075-T6 alloys, with levels similar to those achieved by etching in sodium hydroxide solution. Conventional durations of de-smutting treatments in nitric acid have minor influences on the magnitude of enrichment.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Y. Liu, M.A. Arenas, A. de Frutos, J. de Damborenea, A. Conde, P. Skeldon, G.E. Thompson, P. Bailey, T.C.Q. Noakes,