Article ID Journal Published Year Pages File Type
193973 Electrochimica Acta 2007 10 Pages PDF
Abstract

Electrocodeposition of alumina particles with copper and nickel from acidic electrolytes has been investigated using different deposition techniques. Compared to direct current (DC) deposition, both pulse plating (PP) and pulse-reverse plating (PRP) facilitated higher amounts of particle incorporation. With conventional DC plating the maximum alumina incorporation is ∼1.5 wt% in a nickel and ∼3.5 wt% in a copper matrix. However, the implementation of rectangular current pulses can give considerably higher particle contents in the metal layer. A maximum incorporation of 5.6 wt% Al2O3 in a copper matrix was obtained by PP at a peak current of 10 A dm−2, a duty cycle of 10% and a pulse frequency of 8 Hz. In general, low duty cycles and high pulse frequencies lead to an enhanced particle codeposition. The microstructure and the hardness of both pure metal films and nanocomposite coatings showed only a weak dependence on the PP and PRP conditions.

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Physical Sciences and Engineering Chemical Engineering Chemical Engineering (General)
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