| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 196015 | Electrochimica Acta | 2006 | 5 Pages |
Abstract
The use of pyridine-2,6-dicarboxylic and 4-hydroxypyridine-2,6-dicarboxylic acids as copper(II) ligands in formaldehyde-containing alkaline electroless copper plating solutions allowed to obtain copper layers with extremely high surface roughness factor reaching approximately 120. The Cu deposits of higher surface area were formed at highly negative open-circuit (mixed) potentials; the correlation between copper electrode overpotential and roughness of the deposit was found and discussed. The copper films obtained demonstrate a high electrocatalytic activity in anodic formaldehyde oxidation process, the oxidation rate reaches 40 mA cm−2 and exceeds considerably that for other copper surfaces.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Eugenijus Norkus, Algirdas Vaškelis, Janė Jačiauskienė, Irena Stalnionienė, Giedrius Stalnionis,