Passivation and pitting corrosion of nanostructured Sn–Ni alloy in NaCl solutions

The passivation and pitting corrosion of tin–nickel alloy (34% Ni–66% Sn) in NaCl solution was studied using potentiodynamic, cyclic voltammetry and electrochemical impedance spectroscopy (EIS) techniques complemented by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The effect of concentration of the chloride ion, the switching potential, scans rate and pH on the electrochemical behavior of Sn–Ni alloy is discussed. The data indicate that the corrosion rate and the pitting corrosion of Sn–Ni alloy increases by the increasing of chloride ion concentration. The observed corrosion resistance of electrodeposited Sn–Ni alloy is due to the formation of a thin passive film from tin and nickel oxides.