Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
217627 | Journal of the Chinese Institute of Chemical Engineers | 2008 | 5 Pages |
Because of increasing interest in environmentally benign fabrication process, the use of dry cleaning processes to remove residues of metal, photoresists, organic moieties and particles from surfaces has grown as a research area. In this study, we designed series of systematic approaches to understand the properties of the hard-baked photoresist on glass substrates. We focused on the effects of de-bonding photoresists on the surface by using a plasma-assisted supercritical carbon dioxide removal process with various control parameters. Changes in the surface morphology of plasma de-bonded photoresists were observed and analyzed. A weight-loss method was used to evaluate quantitatively the efficiency of photoresist stripping by SCCO2. Compared to the blank experiment (SCCO2 process only), the photoresist residue reduces to 14.7% from 76.3%. This study demonstrates the possibility of incorporating plasma pretreatment into the supercritical carbon dioxide removal process for photoresist stripping applications.