Article ID Journal Published Year Pages File Type
219131 Journal of Electroanalytical Chemistry 2013 7 Pages PDF
Abstract

We report a selective growth method of copper (Cu) nanoparticles electrodeposition on hexagonally patterned electrodes by self-assembled gold nanoparticles (Au NPs). The self-assembled Au NPs behave as an electrocatalysis seed layer for Cu electrodeposition. Au NPs activate the inhibited site (without defects) of bare HOPG for the same applied potential. The dodecanethiol ligands around the Au NPs fix the distance between them and avoid the coalescence processes in the first electrodeposition stage. The hexagonal periodicity of the Au NPs is well reproduced. This nanostructuring method provides a promising way to control the electrodeposits growth into ordered structure at nanometer resolution.

► Selective growth method of Cu NPs electrodeposition on Au NPs monolayer is presented. ► Self assembled Au NPs behave as electrocatalysis seed layer. ► Hexagonal periodicity of Au NPs is well reproduced. ► Proposed method provides surface nanostructuring at nanometer resolution.

Related Topics
Physical Sciences and Engineering Chemical Engineering Chemical Engineering (General)
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