Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
227211 | Journal of Industrial and Engineering Chemistry | 2015 | 4 Pages |
A urethane-containing epoxy resin was successfully synthesized by reacting bisphenol A with 1,6-hexamethylene diisocyanate and epichlorohydrin. The chemical structure of urethane-containing epoxy resin was confirmed using FT-IR, 1HNMR, and elemental analysis. DSC results indicated that the initial curing and maximum exothermic peak temperatures of urethane-containing epoxy resin cured with 4,4′-diaminodiphenylmethane were 60 °C and 135 °C, respectively; these values were lower than those of a bisphenol A-based epoxy resin. The thermal stability of epoxy resins was studied using TGA, and it was found that the degradation temperature of urethane-containing epoxy resin was lower than that of bisphenol A-based epoxy resin under the same conditions.
Graphical abstractIn the first, the hydroxyl groups of bisphenol A react with the isocyanate groups of 1,6-hexamethylene diisocyanate to form intermediate. In the second step, intermediate reacts with epichlorohydrin to afford urethane-containing epoxy resin.Figure optionsDownload full-size imageDownload as PowerPoint slide