Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
228334 | Journal of Industrial and Engineering Chemistry | 2010 | 4 Pages |
Abstract
An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 °C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Young Rok Ham, Sun Hee Kim, Young Jae Shin, Dong Ho Lee, Minhee Yang, Ji Hye Min, Jae Sup Shin,