Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
279189 | International Journal of Solids and Structures | 2009 | 9 Pages |
Abstract
Solutions of the stress field due to the eigenstrain of an ellipsoidal inclusion in the film/substrate half-space are obtained via the Fourier transforms and Stroh eigenrelation equations. Based on the acquired solutions, the effect of a thin film’s thickness on the stress field is investigated with two types of ellipsoidal inclusions considered. The results in this paper show that if the thickness of the thin film increases, its effect on the stress field will become weaker, and can even be neglected. In the end, a guide rule is introduced to simplify the calculation of similar problems in engineering.
Related Topics
Physical Sciences and Engineering
Engineering
Civil and Structural Engineering
Authors
Xinghua Liang, Biao Wang, Yulan Liu,