Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
279333 | International Journal of Solids and Structures | 2009 | 11 Pages |
The problem of a thin film coated on an elastic layer and subject to a thermal variation is analytically investigated in the present work. The analysis is developed in order to assess the mechanical behaviour of a crystalline undulator designed for obtaining high emission radiations through channelling phenomenon. It consists in a plane silicon wafer alternately patterned with thin films in silicon nitride on both surfaces. The system adopts a periodic curvature as a result of the misfit strain due to the different thermal expansivities of the layer and the film. The problem is governed by an integral equation which can be reduced to a linear algebraic system by approximating the unknown interfacial shear stress via series expansion of Chebyshev polynomials.