| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 279632 | International Journal of Solids and Structures | 2007 | 11 Pages |
Abstract
A finite mode III crack in a piezoelectric semiconductor of 6 mm crystals is analyzed. Fourier transform is employed to reduce the mixed boundary value problem to a pair of dual-integral equations. Numerical solution of these equations yields coupled electromechanical fields, the intensity factor and the energy release rate near the crack tip. Numerical results are presented graphically to show the fracture behavior which is affected by the semiconduction.
Keywords
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Physical Sciences and Engineering
Engineering
Civil and Structural Engineering
Authors
Yuantai Hu, Yun Zeng, Jiashi Yang,