| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4764881 | Data in Brief | 2017 | 5 Pages |
Abstract
The data presented in this article are related to the research article entitled: “Solder free joining as a highly effective method for making contact between thermoelectric materials and metallic electrodes” (Malik et al., 2017) [1]. This article presents microstructure obtained by scanning electron microscopy (SEM) and chemical analysis by energy dispersive X-ray spectroscopy (EDX) point measurements of the thermoelectric ZnSb legs after joining to metallic electrodes using solder (Zn-2Al) and free-soldering methods.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Safdar Abbas Malik, Le Thanh Hung, Ngo Van Nong,