Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4908065 | Journal of Electroanalytical Chemistry | 2017 | 23 Pages |
Abstract
Porous copper was electrodeposited using hydrogen bubble dynamic template. Various electrolytes having CuSO4 and H2SO4 in fixed molar ratio approximately equal to 0.3 and at temperature 18 °C were utilized for potentiostatic electrodeposition at various cathodic potentials. After electrodeposition, electrochemical impedance spectroscopy studies were conducted in 2.5 M NaCl solution at room temperature for determining electrochemically active true surface area. The surface morphologies of the deposits were analyzed using scanning electron microscope. Electrolyte with composition 0.12 M CuSO4 and 0.4 M H2SO4 resulted in maximum electrochemically active true surface area due to more open structure with thick dendrite branches which was correlated to high hydrogen evolution rate.
Keywords
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Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Himanshu Singh, Dheeraj P.B., Yash Pratap Singh, Gaurav Rathore, Mukesh Bhardwaj,