Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4993895 | International Journal of Heat and Mass Transfer | 2017 | 8 Pages |
Abstract
The heat and mass transport processes were investigated with numerical simulations in a vacuum vapour phase soldering system during the vapour suctioning process. Low vapour pressure/concentration is applied during vacuum soldering to decrease the number of gas voids in the solder joints. Three-dimensional numerical flow model was developed which based on the Reynolds averaged Navier-Stokes equations with the standard k-ε turbulence method. The decrease of the vapour concentration and its effects on the solder joints were studied in the case of different oven settings. It was found that vapour suctioning has considerable effects on the heat transfer processes in the soldering chamber which might lead to early solidification of the solder joints and reduces the efficiency of the void removal. Different oven settings were simulated in order to decrease the heat loss of the soldering chamber during the vapour suctioning. It was shown that with appropriate setting of the vacuum vapour phase soldering technology, the efficiency of the void removal can be increased.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Balázs Illés, Agata Skwarek, Attila Géczy, Olivér Krammer, David BuÅ¡ek,