Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire

Sawn kerf, wafer profile error and wafer subsurface damage were systematically measured and were used to evaluate the materials loss for the sapphire slicing with the fixed diamond wire. The vibration of saw wire was also measured during the slicing process. The impact of each part on the materials loss was discussed. The effect of the wire vibration on the materials loss was explored. It was found that the sawn kerf loss and the wafer profile error loss were the main forms of the materials loss during the slicing process. Wire vibration has significant influence on sliced wafer morphology. Influence of slice parameters on the kerf loss is similar with the case on the vibration amplitude, which indicates that the wire vibration is the key factor to cause the kerf loss. Wire slicing model with the wire vibration is established to understand the influence of wire vibration on the materials loss.