Electrodeposited copper current collecting fingers for DSSCs

For lowering sheet resistance of the TCO, metal fingers are commonly deposited over TCO by methods like vapor deposition, screen printing. The present study reports development of copper current collecting fingers over TCO substrates, involving no high temperature processing step, through electrodeposition. The copper current collecting fingers showed excellent adhesion to the substrate and resulted in improvement in performance over cells prepared on TCO substrate without the fingers owing to decrease in the series resistance in the former case.