Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process

•A multi-functional wafer level package for white LED system has been designed and manufactured.•7-mask BiCMOS process was applied to simply manufacture all package units.•All sensors (temperature and blue selective light sensors) were integrated in the package.•Each sensor has been designed, characterized and calibrated to be part of the smart monitoring unit.•An interdigitated power transistor and a 4-bit flash ADC were also monolithically integrated.

Today, finding a low cost, efficient, functional and reliable solution for controlling smart lighting systems has become topic of many research groups and industry. In this study, a multi-functional wafer level package (WLP) for phosphor-based white LED system has been designed and manufactured using 7-mask BiCMOS process. This package integrates 4 high power blue LED dies with a temperature sensor and a blue selective light sensor for monitoring system performance. Each sensor has been designed, characterized and calibrated to be part of the smart monitoring unit. An interdigitated power transistor and a 4-bit flash analog-to-digital converter (ADC) were also monolithically integrated with sensors' readout and extra controlling functions.