Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5013456 | Engineering Failure Analysis | 2017 | 10 Pages |
Abstract
This paper presents a reliability study of an AlGaN/GaN high electron mobility transistor (HEMT) by the photon emission (PE) and the spectral photon emission (SPE) techniques. The backside PE analysis of the studied AlGaN/GaN HEMT identifies PE signatures at the gate foot edge on the drain side, and at two new positions: under the middle of the gate or at the gate foot edge on the source side. The SPE analysis of the localized signatures defines the deep level trap energy Ec-1.35Â eV which seems to be related to an interstitial carbon defect that forms along dislocations, or an omnipresent defect such as C or possibly dislocations.
Related Topics
Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
Niemat Moultif, Alexis Divay, Eric Joubert, Olivier Latry,